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Original JK-SMD1210-110 1.1A 12V 1100MA 1210 SMD Self-Recovery Fuse

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Original JK-SMD1210-110 1.1A 12V 1100MA 1210 SMD Self-Recovery Fuse

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Brand Name :	LINKUN
Model Number :	JK-SMD1210
Certification :	RoHS
Price :	US $0.2 ~ 0.6 PCS
Payment Terms :	T/T, D/P, D/A, Western Union, MoneyGram
Supply Ability :	100,000 pieces/month
Delivery Time :	5-7 days

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Product Details
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Original JK-SMD1210-110 1.1A 12V 1100MA 1210 SMD Self-Recovery Fuse

Surface Mountable PTC Resettable Fuse: JK-SMD1206 Series

Features:

RoHS Compliant ＆ Halogen Free
faster tripping, 1210 Dimension, Surface mountable, Solid state
Operation Current: 0.05A~2.00A
Maximum Voltage: 6V~60Vdc
Operating Temperature:-40℃ TO 85℃

Product Dimensions

Terminal pad materials :Tin-Plated Nickle-copper

Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.

Unit :mm

Part Number	Marking	A		B		C		D	E
Part Number	Marking	Min	Max	Min	Max	Min	Max	Min	Min
JK-SMD1210-005	JZ	3.00	3.43	2.35	2.80	0.60	1.25	0.15	0.10
JK-SMD1210-010	JN	3.00	3.43	2.35	2.80	0.60	1.25	0.15	0.10
JK-SMD1210-020	JF	3.00	3.43	2.35	2.80	0.50	1.00	0.15	0.10
JK-SMD1210-030	JB	3.00	3.43	2.35	2.80	0.35	0.85	0.25	0.10
JK-SMD1210-035	JB	3.00	3.43	2.35	2.80	0.35	0.90	0.15	0.10
JK-SMD1210-035-30	JB	3.00	3.43	2.35	2.80	0.35	1.00	0.15	0.10
JK-SMD1210-050	JG	3.00	3.43	2.35	2.80	0.35	0.90	0.15	0.10
JK-SMD1210-050-30	JG	3.00	3.43	2.35	2.80	0.60	1.20	0.25	0.10
JK-SMD1210-075	JA	3.00	3.43	2.35	2.80	0.35	0.85	0.15	0.10
JK-SMD1210-075-16	JA	3.00	3.43	2.35	2.80	0.60	1.30	0.25	0.10
JK-SMD1210-075-24	JA	3.00	3.43	2.35	2.80	0.50	1.10	0.15	0.10
JK-SMD1210-100	JH	3.00	3.43	2.35	2.80	0.40	1.10	0.25	0.10
JK-SMD1210-110	JK	3.00	3.43	2.35	2.80	0.40	1.00	0.15	0.10
JK-SMD1210-110-12	JK	3.00	3.43	2.35	2.80	0.50	1.10	0.15	0.10
JK-SMD1210-110-16	JK	3.00	3.43	2.35	2.80	0.50	1.10	0.15	0.10
JK-SMD1210-150	JK	3.00	3.43	2.35	2.80	0.60	1.40	0.15	0.10
JK-SMD1210-175	JK	3.00	3.43	2.35	2.80	0.60	1.50	0.15	0.10
JK-SMD1210-200	JK	3.00	3.43	2.35	2.80	0.60	1.50	0.15	0.10

Thermal Derating Chart-IH(A)

Part number	Maximum ambient operating temperatures(℃)
Part number	-40	-20	0	25	40	50	60	70	85
JK-SMD1210-005	0.08	0.07	0.06	0.05	0.04	0.04	0.03	0.03	0.02
JK-SMD1210-010	0.16	0.14	0.12	0.10	0.08	0.07	0.06	0.05	0.05
JK-SMD1210-020	0.29	0.26	0.22	0.20	0.16	0.14	0.13	0.11	0.08
JK-SMD1210-035	0.47	0.45	0.40	0.35	0.33	0.28	0.24	0.21	0.18
JK-SMD1210-035-30	0.47	0.45	0.40	0.35	0.33	0.28	0.24	0.21	0.18
JK-SMD1210-050	0.76	0.67	0.58	0.50	0.43	0.40	0.36	0.32	0.28
JK-SMD1210-050-30	0.76	0.67	0.58	0.50	0.43	0.40	0.36	0.32	0.28
JK-SMD1210-075	1.00	0.97	0.86	0.75	0.64	0.59	0.54	0.48	0.40
JK-SMD1210-075-24	1.00	0.97	0.86	0.75	0.64	0.59	0.54	0.48	0.40
JK-SMD1210-110	1.60	1.42	1.26	1.10	0.94	0.86	0.80	0.70	0.58
JK-SMD1210-110-12	1.60	1.42	1.26	1.10	0.94	0.86	0.80	0.70	0.58
JK-SMD1210-110-16	1.60	1.42	1.26	1.10	0.94	0.86	0.80	0.70	0.58
JK-SMD1210-150	2.30	2.02	1.76	1.50	1.24	1.11	1.00	0.85	0.65
JK-SMD1210-175	2.45	2.22	2.01	1.75	1.45	1.26	1.10	0.98	0.80
JK-SMD1210-200	2.60	2.44	2.35	2.00	1.78	1.67	1.50	1.45	1.10

Electrical Characteristic

Part Number	V_max	I_max	I_hold	I_trip	P_d	Maximum time to trip		Resistence
	(Vdc)	(A)	(A)	(A)	Max. (W)	Current	Time	Ri_min	R1_max
	(Vdc)	(A)	(A)	(A)	Max. (W)	(A)	(Sec)	(W)	(W)
JK-SMD1210-005	60	100	0.05	0.15	0.6	0.25	1.50	2.8	50
JK-SMD1210-010	60	100	0.10	0.30	0.6	0.50	0.60	0.8	15
JK-SMD1210-020	30	100	0.20	0.40	0.6	8.0	0.02	0.40	5
JK-SMD1210-030	24.0	100	0.30	0.75	0.6	8.0	0.20	0.40	2.5
JK-SMD1210-035-30	30	100	0.35	0.75	0.6	8.0	0.20	0.20	1.3
JK-SMD1210-035	16	100	0.35	0.75	0.6	8.0	0.20	0.20	1.3
JK-SMD1210-050	16	100	0.50	1.00	0.6	8.0	0.10	0.18	0.9
JK-SMD1210-050-30	30	100	0.50	1.00	0.6	8.0	0.10	0.180	0.9
JK-SMD1210-075	6	100	0.75	1.50	0.6	8.0	0.10	0.07	0.4
JK-SMD1210-075-16	16	100	0.75	1.50	0.6	8.0	0.10	0.07	0.45
JK-SMD1210-075-24	24	100	0.75	1.50	0.6	8.0	0.10	0.07	0.45
JK-SMD1210-100	12	100	1.00	2.00	0.6	8.0	0.30	0.05	0.27
JK-SMD1210-110	6	100	1.10	2.20	0.6	8.0	0.30	0.05	0.21
JK-SMD1210-110-12V	12	100	1.10	2.20	0.8	8.0	0.30	0.05	0.25
JK-SMD1210-110-12V	12	100	1.10	2.20	0.8	8.0	0.30	0.05	0.25
JK-SMD1210-150	6	100	1.50	3.00	0.8	8.0	0.50	0.03	0.11
JK-SMD1210-175	6	100	1.75	3.50	0.8	8.0	0.60	0.02	0.08
JK-SMD1210-200	6	100	2.00	4.00	0.8	8.0	1.00	0.015	0.07

Test Procedures And Requirements

Test	Test Conditions	Accept/Reject Criteria
Resistance	In still air @ 25℃	R_min≤R≤R_max
Time to Trip	Specified current,V_max,25℃	Tmaximum Time to Trip
Hold Current	30min,at I_H	No trip
Trip Cycle Life	Vmax,Imax,100cycles	No arcing or burning
Trip Endurance	Vmax,1 hours	No arcing or burning

Physical Characteristics and Environmental Specifications

Physical Characteristics

Terminal materials :	Tin-Plated Nickle-copper
Soldering zone	Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Environmental Specifications
Test	Conditions	Resistance Change
Passive aging	85℃,1000hours	±10%
Humidity aging	85℃/85%RH.168 hours	±5%
Thermal shock	MIL-STD-202,Method 107G +85℃/-40℃,20times	±33% typical resistance change
Solvent Resistance	MIL-STD-202,Method 215	no change
Vibration	ML-STD-883C,Test Condition A	No chage

Electrical Specifications:

I_hold = Hold Current. Maximum current device will not trip in 25°C still air.

I_trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

V_max = Maximum operating voltage device can withstand without damage at rated current (Imax).

I_max = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Ri_min/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1_max = Maximum device resistance is measured one hour post reflow.

Recommended pad layout (mm)

Solder reflow conditions

Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.

● Devices are not designed to be wave soldered to the bottom side of the board.

● Recommended maximum paste thickness is 0.25mm (0.010inch).

● Devices can be cleaned using standard industry methods and solvents.

● Soldering temprature profile meets RoHsleadfree process.

Notes: If reflow temperatures exceed the recommended profile, devices may not meet the

performance requirements

Tape Specification And Reel Dimensions

Coverning Specifications EIA 481-1(Unit:mm)
W	8.00± 0.10
P₀	4.0 ± 0.10
P₁	4.0± 0.10
P₂	2.0 ± 0.05
A₀	0.95 ± 0.10
B₀	1.85± 0.05
D₀	1.55± 0.05
F	3.50± 0.05
E₁	1.75 ± 0.10
T	0.20± 0.02
Leader min.	390
Trailer min.	160
Reel Dimensions
A		178±1.0
N		59±1
W₁		8.5+1.0/-0.2
W₂		12.0±1

Packaging Quantity

Part number	Quantity	Part number	Quantity
JK-SMD1210-005	4000	JK-SMD1210-075	4000
JK-SMD1210-010	4000	JK-SMD1210-075-24	4000
JK-SMD1210-020	4000	SMD1210-110	4000
JK-SMD1210-035-30V	4000	SMD1210-110-12	4000
JK-SMD1210-035	4000	SMD1210-110-16	4000
JK-SMD1210-050	4000	SMD1210-150	4000
SMD1210-175	3000/4000	SMD1210-200	3000/4000

Storage

The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present

WARNING

• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.

• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.

• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components.

• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods.

• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices.

Notes

The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit

production devices,However,users should imdependently evaluate and test the suitability of each product.JinRui makes on warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,JinRui’s only obligations are those im the JinRui Standard Rerms and Conditions of Sale and in no case will JinRui be liable for any incidental,imdirect,or consequential damages arising from the sale,resale,ormisues of its products.Jinrui reserves the right to change of update,without notice,any information contained in this specification.

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